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            Department of Drilling Engineering

            Dr. Dong Xuelin

            Education
            PhD from Tsinghua University (China)
            Bachelor from Tsinghua University (China)

            Research Areas of Research Focus
            Well integrity in drilling, completion and operation

            Mechanism of casing failure study
            Coating technology for oil and gas industry
             
            Teaching
            Mechanics of Materials, Engineering Mechanics
             
            Contact
            Email:  dongxl@cup.edu.cn    TEL:    Fax:
            Address of Office: Room 1103, Block A, Zhongyou Mansion, China University of Petroleum-Beijing, 18 Fuxue Road, Changping, Beijing China 102249
             
            Publications
            [1] X. Dong, X. Feng, K-C. Hwang. Stress–diffusion interaction during oxidation at high temperature. Chemical Physics Letters, 2014, 614:95-98.
            [3] C. Zhang, X. Dong, X. Feng, K-C. Hwang. Multiwavelength shearing interferometry for measuring the slopes, curvatures, and shapes of thin films/substrate systems. Optics Letters, 2013, 38(24):5446-5449.
            [4] X. Dong, C. Zhang, X. Feng, K.C. Hwang, Full-field Measurement of Topography and Curvature by Coherent Gradient Sensing Method at High Temperature, Experimental Mechanics, 2013(53): 959-963.
            [5] X. Dong, X. Fang, X. Feng, K.-C. Hwang, Diffusion and Stress Coupling Effect during Oxidation at High Temperature, Journal of the American Ceramic Society, 2013(96): 44-46.
            [6] X. Dong, X. Feng, K.-C. Hwang, Oxidation stress evolution and relaxation of oxide film/metal substrate system, Journal of Applied Physics, 2012(112): 023502.
            [7] X. Dong, X. Feng, K.-C. Hwang, S. Ma, Q. Ma, Full-field measurement of nonuniform stresses of thin films at high temperature, Optics Express, 2011(19): 13201-13208.
            [8] X. Dong, X. Feng, K. Hwang, Non-uniform stress distribution and deformation bifurcation of thin film/substrate system subjected to gradient temperature, Thin Solid Films, 2011(519): 2464-2469.
             
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